Capabilities
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Items
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Mass Production
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Sample
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Max.Layer Count
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30 Layers
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30 Layers
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Max.Panel Size
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21"x24"
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21"x26"
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Max.Board Thickness
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3.2mm
|
5.8mm
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Min.Trace Width/Spacing
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Outer Layer
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3.5/3.5mils
|
3/3mils
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Inner Layer
|
3.5/3.5mils
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3/3mils
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Min.Board Thickness
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2L:12mils
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2L:12mils
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4L:16mils
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4L:14mils
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6L:32mils
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6L:24mils
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Min.SMT/BGA Pitch
|
12mils for SMT
|
12mils for SMT
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24mils for BGA
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20mils for BGA
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Min.Drill Size&Aspect Ratio
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0.2mm Drill for 0.8mm Thickness(4.0:1)
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0.2mm Drill for 0.8mm Thickness(4.0:1)
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0.25mm Drill for 1.6mm Thickness(6.4:1)
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0.25mm Drill for 1.6mm Thickness(6.4:1)
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0.30mm Drill for 2.4mm Thickness(8.0:1)
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0.30mm Drill for 2.4mm Thickness(8.0:1)
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Surface Finishes
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HASL
|
HASL
|
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Selective Immersion Tin
|
Selective Immersion Tin
|
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Immersion Gold
|
Immersion Gold
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OSP
|
OSP
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Gold finger
|
Gold finger
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Controlled Impedance
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+/- 10%
|
+/-7%
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Contouring
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Routing, V-Groove,
|
Routing, V-Groove,
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Beveling Punch
|
Beveling Punch
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Hole Diameter
|
+/- 2 mil
|
+/- 2 mil
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Min.S/M Thickness
|
0.4 mil
|
0.6 mil
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