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Items
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Mass Production
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Sample
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Max.Layer Count
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8Layers
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10Layers
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Max.Panel Size
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21"x24"
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21"x26"
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Max.Board Thickness
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3.2mm
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5.8mm
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Min.Trace Width/Spacing
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Outer Layer
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3.5/3.5mils
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3/3mils
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Inner Layer
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3.5/3.5mils
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3/3mils
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Min.Board Thickness
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2L:12mils
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2L:12mils
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4L:16mils
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4L:14mils
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6L:32mils
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6L:24mils
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Min.SMT/BGA Pitch
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12mils for SMT
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12mils for SMT
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24mils for BGA
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20mils for BGA
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Min.Drill Size&Aspect Ratio
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0.2mm Drill for 0.8mm Thickness(4.0:1)
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0.2mm Drill for 0.8mm Thickness(4.0:1)
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0.25mm Drill for 1.6mm Thickness(6.4:1)
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0.25mm Drill for 1.6mm Thickness(6.4:1)
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0.30mm Drill for 2.4mm Thickness(8.0:1)
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0.30mm Drill for 2.4mm Thickness(8.0:1)
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Surface Finishes
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HASL
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HASL
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Selective Immersion Tin
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Selective Immersion Tin
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Immersion Gold
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Immersion Gold
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OSP
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OSP
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Gold finger
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Gold finger
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Controlled Impedance
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+/- 10%
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+/-7%
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Contouring
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Routing, V-Groove,
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Routing, V-Groove,
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Beveling Punch
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Beveling Punch
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Hole Diameter
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+/- 2 mil
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+/- 2 mil
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Min.S/M Thickness
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0.4 mil
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0.6 mil
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