 |
E-mail: info@superpcb.com
Phone: (214) 550-9837 |
 |
|
 |
|
| Home > Capabilities |
| Capabilities |
| Items |
Mass Production |
Sample |
| Max.Layer Count |
30 Layers |
30 Layers |
| Max.Panel Size |
27.5"x24" |
27.5"x24" |
| Max.Board Thickness |
3.5mm |
5.8mm |
| |
|
|
| Min.Trace Width/Spacing |
|
|
| Outer Layer |
3.5/3.5mils |
3/3mils |
| Inner Layer |
3.5/3.5mils |
3/3mils |
| |
|
|
| Min.Board Thickness |
2L:6mils |
2L:6mils |
| |
4L:15mils |
4L:15mils |
| |
6L:23mils |
6L:23mils |
| |
|
|
| Min.SMT/BGA Pitch |
12mils for SMT |
12mils for SMT |
| |
24mils for BGA |
20mils for BGA |
| |
|
|
| Min.Drill Size&Aspect Ratio |
0.2mm Drill for 0.8mm Thickness(4.0:1) |
0.2mm Drill for 0.8mm
Thickness(4.0:1) |
| |
0.25mm Drill for 1.6mm
Thickness(6.4:1) |
0.25mm Drill for 1.6mm
Thickness(6.4:1) |
| |
0.30mm Drill for 2.4mm
Thickness(8.0:1) |
0.30mm Drill for 2.4mm
Thickness(8.0:1) |
| |
|
|
| Surface Finishes |
HASL |
HASL |
| |
Selective Immersion Tin |
Selective Immersion Tin |
| |
Immersion Silver |
Immersion Silver |
| |
Immersion Gold |
Immersion Gold |
| |
Hard Gold |
Hard Gold |
| |
OSP |
OSP |
| |
Gold finger |
Gold finger |
| |
|
|
| Controlled Impedance |
+/- 10% |
+/-7% |
| |
|
|
| Contouring |
Routing, V-Groove, |
Routing, V-Groove, |
| |
Beveling Punch |
Beveling Punch |
| |
|
|
| Hole Diameter |
+/- 2 mil |
+/- 2 mil |
| |
|
|
| Min.S/M Thickness |
0.4 mil |
0.6 mil |
|
|
 |
 |
| Super PCB © 2010. All rights reserved |
 |
|
 |
|
